JOURNAL DE PHYSIQUE Colloque C6, suppl6ment au n0ll, Tome 49, novembre 1988 ATOM PROBE INVESTIGATION OF THE OXIDATION OF Ni-Zr INTERMETALLIC COMPOUNDS E.M. PERRY, D.L. COCKE and M.K. MILLER* An Investigation of Copper Dissolution and the form a layer of the intermetallic compound (IMC) Cu6Sn5, at the solder/copper interfaces. Although formation and presence of the IMC layer is desirable for good wetting and bonding, an excessively thick layer is detrimental due to its intrinsic brittleness that makes it susceptible and/or prone to mechanical failures even at low loads .
Investigation of the Intermetallic Formation on Wet Underwater Welding of AISI 4012 Steel p.10 Effect of Magnesium on the Strength, Stiffness and Toughness of Nodular Cast Iron Defect Investigation of Sand Casted Aluminum Cooling Fan Investigation of the Intermetallic Formation on Wet Underwater Welding of AISI 4012 Steel p.10 Effect of Magnesium on the Strength, Stiffness and Toughness of Nodular Cast Iron EFFECTS OF ENIG NICKEL CORROSION ON WETTING This paper attempts to further clarify the effects of nickel corrosion on solder wetting balance test results and the resultant intermetallic formed. The study will attempt to produce level 1, level 2, and level 3 corrosion as denoted by IPC- 4552 rev A and tabulate wetting balance results and congruity of intermetallic formed. Key words:ENIG, corrosion, intermetallic formation, solder wetting balance.
The solution-reaction calorimetric method was used for the determination of the formation enthalpy of the Li22Si5 intermetallic compound and the heat of the reaction of the Li-component with an Formation Investigation of Intermetallic Compounds of The results indicated that there were two different formation mechanisms of intermetallic compounds at the interface of thick plate Al/Mg joint. The first was constitutional liquation, and eutectic structure consisting of Al 12 Mg 17 and Mg solid solution existed at the Influence of benzene on the Ni3Fe nanocrystalline Feb 15, 2011 · It was concluded that the Ni 3 Fe intermetallic compound is mainly formed after 2 h of wet milling and subsequent annealing. A complete analysis of the influence of the wet milling on the structural and magnetic properties of Ni 3 Fe nanocrystalline compound is presented in detail elsewhere . It was shown that the spontaneous magnetization decreases with increasing milling time and benzene
In this work, we investigate the intermetallic compound formation in Cu wire bonded device. Voids near the Cu side at the bond interface are clearly seen. Nevertheless, these voids do not seem to interfere with the function of the unit. High temperature storage test (HTST) results show that there are Al 2 Cu and AlCu in the damaged unit while Al 2 Cu and Al 4 Cu 9 appear in the good unit. Investigation of the Role of Void Formation at the Cu-to Investigation of the Role of Void Formation at the Cu-to-Intermetallic Interface on Aged Drop Test Performance Abstract:Chip-scale packages (CSPs) are widely used in portable electronic products. Mechanical drop testing is a critical reliability requirement for these products. Investigation of the Role of Void Formation at the Cu-to The Sn finish provides an initial Cu-Sn intermetallic layer, while the Ag finish and OSP coating allows the formation of the initial Cu-Sn intermetallic during the reflow cycle. Drop test results for assemblies as-built and as a function of aging at 125 degC are correlated with cross-sectional analysis of
Lijun Han's 3 research works with 133 citations and 172 reads, including:Optimised design of electrode morphology for novel dissimilar resistance spot welding of aluminium alloy and galvanised Preface Advanced Materials Science II Scientific.NetInvestigation of the Intermetallic Formation on Wet Underwater Welding of AISI 4012 Steel p.10 Effect of Magnesium on the Strength, Stiffness and Toughness of Nodular Cast Iron The influence of hot dip galvanizing process on Jan 30, 2019 · 1 INTRODUCTION. Hot Dip Galvanizing (HDG) is the most used protection technique against corrosion. The importance of HDG is due to the double protection against corrosion:the first one is a barrier shielding the aggressive environment, and the second one is the electrochemical potential of zinc that is lower than both the steel and the iron one.
intermetallic formation, structure, and its impact on the reliability of solder joints was Further wet grinding on successively finer grit abrasive papers was carried out from 240 grit through 600 grit abrasives. Following the grinding, the samples were successively polished with 3 micron As a preliminary investigation of the mechanical